CALL FOR PAPERS TECHNICAL COMMITTEE INVITED SPEAKERS SUBMISSION REGISTRATION VENUE SCHEDULE HISTORY CONTACT
 

Submission Deadline: Before July 25, 2017
Acceptance Notification: August 15, 2017
Registration Deadline: Before September 5, 2017
Camera-Ready Paper Submission: Before September 5, 2017
Conference Date: December 11-13, 2017




Conference Secretary: Cherry Chan

Tel.: +86-28-86512185 (China)
E-mail: icism@iap.org

 


Full Paper (Publication & Presentation)

Follow the template when preparing your full paper:
For option 1, please use Paper Template
; (.doc)
For option 2. please use IJMSE Template; (.doc)

Abstract (Oral Presentation only, without publication)

Follow the template when preparing your abstract:
For option 3. please use Abstract Template; (.doc)

Please submit your full paper/abstract via Easychair subumission system using the following link:

Electronic Submission System; ( .pdf)  

 




Conference Committees

Conference Co-chairs

Prof. Dan A Allwoodallwood, Department of Materials Science and Engineering, The University of Sheffield, UK
Prof. John P. T. Mo, RMIT University, School of Aerospace, Mechanical and Manufacturing Engineering, Melbourne, Australia

Technical Program Chairs

Assoc. Prof. Samer Alfayad, UVSQ , Paris-Saclay University 10-12 Avenue de lEurope, 78140 V´elizy, France
Prof. Emeritus Dato' Dr. Muhammad Yahaya, School of Applied Physics, UKM Malaysia, Malaysia
Prof. Shailesh Rao A., KS School of Engineering and Management, India

Technical Program Committees

Prof. Yaowu Shi, College of Materials Science & Engineering, Beijing University of Technology, China
Prof. Hideo Miura, Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, Japan
Prof. Ildoo Chung, Department of Polymer Science and Engineering, Pusan National University, Korea

Prof. Viktor Zviadauri, Technical University of Georgia, Georgia
Dr. Om Pal Singh Beant College of Engineering & Technology, India
Prof. Handing Guo, Tianjin Institute of Urban Construction, China
Dr. Farooq Ahmad, University of Central Punjab, Pakistan
Dr. Li Du, The University of Akron, USA
Prof. I. N. G. Wardana, Universitas Brawijaya, Indonesia
Dr. Zhang Jing, Sichuan University, China
Dr. Gopal U. Shinde, Marathwada Agricultural University, India
Raj Das, Senior Lecturer, University of Auckland, New Zealand
Dr. Jaroslaw Milewski, Warsaw University of Technology, Poland
Dr. Ajay Kumar Jha, Harbin Institute of Technology, China
Dr. Dong Wang, Sichuan University, China

 

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